On-Chip Decoupling Zone For Package-Stress Reduction
نویسندگان
چکیده
This paper reports the reduction of package-stresses by in tm ducing a decoupling zone directly m u n d a sensor structure. Different geometries of the decoupling zones are compared, using the Fdte Element Method (FEM) and analytical models. A large reduction is obtained in case of a corrugated decoupling zone. To optimize the reduction, an analytical description of a ring-shaped V-groove is given. Finally the influence of a backplate mounted to the sensor chip is disC W d . Fig. 2 Cmss-section of the considered axisymmetric structures with three dixerent options for the decoupling zone: (a) without zone, &) jkt zone and (c) the corrugated .wm.
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